Paper
24 January 2004 Curved MEMS resonators yield infrasonic resonant frequencies on single-chip in simulation study
Carlos P. Borras, Harold L. Stalford
Author Affiliations +
Abstract
This paper is motivated by the challenge to develop mechanical resonators with fundamental resonant frequencies in the infrasonic range 1-20 Hz that fit onto a single-chip module. In this paper, we present preliminary findings based on finite element modeling (FEM) analysis of designs prepared for fabrication based on SUMMiT VTM surface micromachining technology using curve-shaped beams clamped at both ends. Circular shapes considered are a flat-horseshoe shape (thickness is transverse to plane of substrate) and a split-ring shape (width is transverse to plane of substrate). For the FEM simulation study, we considered a single-chip module space size of 6mm diameter and resonators with 1 μm beam thickness. Designs are considered with and without added mass. We find that an order of magnitude reduction in the 1st mode resonant frequency is achievable by curving beams into a space of fixed size. The simulation results show that infrasonic resonant frequencies 2-20 Hz are achievable by curve-shaped resonators with “added mass” with 1 μm beam thickness for single-chip 6mm-diameter size.
© (2004) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Carlos P. Borras and Harold L. Stalford "Curved MEMS resonators yield infrasonic resonant frequencies on single-chip in simulation study", Proc. SPIE 5344, MEMS/MOEMS Components and Their Applications, (24 January 2004); https://doi.org/10.1117/12.524620
Lens.org Logo
CITATIONS
Cited by 1 scholarly publication.
Advertisement
Advertisement
RIGHTS & PERMISSIONS
Get copyright permission  Get copyright permission on Copyright Marketplace
KEYWORDS
Resonators

Optical simulations

Finite element methods

Beam splitters

Computer aided design

Microelectromechanical systems

Sensors

Back to Top