Paper
24 January 2004 Extrinsic Fabry-Perot pressure sensor using single deeply corrugated diaphragm technique
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Abstract
In this study, an analytical model, taking into account the coupled photoelastic and thermal-optical effects, is established to evaluate the temperature dependence of a single-chip silicon micromachined Fabry-Perot pressure sensor. The results show that temperature variation has significant impact on the micromachined Fabry-Perot pressure sensor with conventional flat diaphragm. A new membrane-type silicon micromachined Fabry-Perot pressure sensor with a novel deeply corrugated diaphragm is then proposed. The sensor is fabricated on a single-chip using both surface- and bulk-micromachining techniques. Both analytical and experimental results show that the cross-sensitivity to temperature of Fabry-Perot pressure sensors, can be substantially alleviated by the proposed single deeply corrugated diaphragm/mirror.
© (2004) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
D. G. Guo, W. J. Wang, and Rongming Lin "Extrinsic Fabry-Perot pressure sensor using single deeply corrugated diaphragm technique", Proc. SPIE 5346, MOEMS and Miniaturized Systems IV, (24 January 2004); https://doi.org/10.1117/12.516589
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Cited by 3 scholarly publications.
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KEYWORDS
Sensors

Optical microcavities

Mirrors

Temperature metrology

Silicon

Fabry–Perot interferometers

Thermography

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