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14 June 2004 Advances in hybrid organic/inorganic optoelectronic integration
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We report on advances in the hybrid organic/inorganic integration of passive and active optical functions. The integration approaches include chip-to-chip attach, flip-chip mounting, and insertion of films in slots formed in planar lightwave circuits. The materials integrated include polymer, silica, silicon, silicon oxynitride, lithium niobate, indium phosphide, gallium arsenide, yttrium iron garnet, and neodymium iron boron. The functions enabled by the hybrid integration approaches span the range of building blocks needed in optical circuitry, while using the highest-performance material system for each function. We demonstrate high-functionality optoelectronic integrated circuits, including fully reconfigurable optical add/drop multiplexers and tunable optical transmitters.
© (2004) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Louay A. Eldada, Antonije M. Radojevic, Junichiro Fujita, Tomoyuki Izuhara, and Reinald Gerhardt "Advances in hybrid organic/inorganic optoelectronic integration", Proc. SPIE 5356, Optoelectronic Integrated Circuits VI, (14 June 2004);


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