Carbon nanotube atomic force microscopy cantilevers

Yusuf N. Emirov; J. D. Schumacher; B. Lagel; N. Nguyen; Zhifeng Ren; Zhongping Huang; Benjamin B. Rossie; Rudy Schlaf

doi:10.1117/12.563239

24 May 2004 Carbon nanotube atomic force microscopy cantilevers

Yusuf N. Emirov, J. D. Schumacher, B. Lagel, N. Nguyen, Zhifeng Ren, Zhongping Huang, Benjamin B. Rossie, Rudy Schlaf

Proceedings Volume 5375, Metrology, Inspection, and Process Control for Microlithography XVIII; (2004) https://doi.org/10.1117/12.563239
Event: Microlithography 2004, 2004, Santa Clara, California, United States

Abstract

We report about our progress in developing a process for the manufacture of carbon nanotube (CNT) atomic force microscopy (AFM) cantilevers. Due to their exceptional mechanical properties, CNT are among the most promising materials for high aspect ratio critical dimension metrology (CDM) AFM probes. Our goal is to produce well-defined long lasting CNT probes for CDM measurements in the <100 nm pitch range. Our efforts currently focus on manufacturing precisely aligned CNT having defined locations, diameters and lengths. The CNT are grown using plasma enhanced chemical vapor deposition (PECVD). The CNT growth process is enabled by the presence of a catalyst, which allows precise definition of the growth location. Experimental data from CNT grown on Si AFM probes and catalyst patterns prepared by focused ion beam (FIB) and electron beam lithography (EBL) is being shown. Furthermore, first results from scanning experiments with CNT-AFM cantilevers are shown.

Citation Download Citation

Yusuf N. Emirov, J. D. Schumacher, B. Lagel, N. Nguyen, Zhifeng Ren, Zhongping Huang, Benjamin B. Rossie, and Rudy Schlaf "Carbon nanotube atomic force microscopy cantilevers", Proc. SPIE 5375, Metrology, Inspection, and Process Control for Microlithography XVIII, (24 May 2004); https://doi.org/10.1117/12.563239

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KEYWORDS

Electron beam lithography

Atomic force microscopy

Carbon nanotubes

Manufacturing

Plasma enhanced chemical vapor deposition

Code division multiplexing

Silicon

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