Segmented alignment mark optimization and signal strength enhancement for deep trench process

Yuanting Cui; Frank Goodwin; Richard van Haren

doi:10.1117/12.532896

24 May 2004 Segmented alignment mark optimization and signal strength enhancement for deep trench process

Yuanting Cui, Frank Goodwin, Richard van Haren

Proceedings Volume 5375, Metrology, Inspection, and Process Control for Microlithography XVIII; (2004) https://doi.org/10.1117/12.532896
Event: Microlithography 2004, 2004, Santa Clara, California, United States

Abstract

This study characterizes the process influence on the alignment signal of deep trench (DT) process, and correlates product overlay with alignment results based on volume production data. The affecting processes include various steps of polysilicon thickness, nitride and oxide films, recess etch depth control, and resist thickness impact. Correlation also proves that the alignment signal plays an important role at the resulted long-term overlay stability. In order to improve the signal strength, further study focuses on the alignment optimization through mark design for deep trench process. The alignment marks evaluated include Scribe-lane Primary Marks (SPM) with difference process segmentations, short SPM marks and Versatile SPM marks. A good correlation is established between varying trench width or line width of mark segmentation and alignment signal strength. Comparison is also done for the signal strength between SPM mark and SSPM marks, between standard SPM mark and pure higher order marks.

Citation Download Citation

Yuanting Cui, Frank Goodwin, and Richard van Haren "Segmented alignment mark optimization and signal strength enhancement for deep trench process", Proc. SPIE 5375, Metrology, Inspection, and Process Control for Microlithography XVIII, (24 May 2004); https://doi.org/10.1117/12.532896

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