Paper
24 May 2004 Time-based PEB adjustment for optimizing CD distributions
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Abstract
In this paper we investigate the impact of bake plate temperature variability throughout the entire bake trajectory on resulting critical dimension. For a poorly-controlled bake plate, it is found that the correlation between the temperature profile and CD distribution is high throughout the entire bake cycle, including the steady state sector. However, for a well-controlled, multiple-zone bake plate, the correlation is only significant during the transient heating sector, since in those cases the steady state plate behavior has already been optimized for CDU performance. An estimate of the potential improvement yet to be gained by improvement of transient heating uniformity is calculated.
© (2004) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Paul D. Friedberg, Cherry Tang, Bhanwar Singh, Thomas Brueckner, Wolfram Gruendke, Bernd Schulz, and Costas J. Spanos "Time-based PEB adjustment for optimizing CD distributions", Proc. SPIE 5375, Metrology, Inspection, and Process Control for Microlithography XVIII, (24 May 2004); https://doi.org/10.1117/12.535871
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Cited by 14 scholarly publications.
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KEYWORDS
Critical dimension metrology

Semiconducting wafers

Temperature metrology

193nm lithography

Data modeling

Photoresist materials

Scatterometry

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