High-temperature negative resist tunable for new lift-off applications

Medhat A. Toukhy; PingHung Lu; Kate Kao; Robert Plass; Ching-Hui Chen; Gerald L. Faerber

doi:10.1117/12.537561

14 May 2004 High-temperature negative resist tunable for new lift-off applications

Medhat A. Toukhy, PingHung Lu, Kate Kao, Robert Plass, Ching-Hui Chen, Gerald L. Faerber

Proceedings Volume 5376, Advances in Resist Technology and Processing XXI; (2004) https://doi.org/10.1117/12.537561
Event: Microlithography 2004, 2004, Santa Clara, California, United States

Abstract

A new negative resist performance was demonstrated for elevated temperature, thick metal sputter process and lift-off application. This resist, AZ EXP nLOF 7000, can endure temperatures in excess of 220°C without pattern profile slope change. The applied resist thickness is ~ 3 μm and is processed to produce sufficient side wall slope adequate for up to 2μm sputter deposited metal thickness and lift-off process.

Citation Download Citation

Medhat A. Toukhy, PingHung Lu, Kate Kao, Robert Plass, Ching-Hui Chen, and Gerald L. Faerber "High-temperature negative resist tunable for new lift-off applications", Proc. SPIE 5376, Advances in Resist Technology and Processing XXI, (14 May 2004); https://doi.org/10.1117/12.537561

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