Process effects in flare measurement

Pary Baluswamy; Linda Somerville

doi:10.1117/12.535474

28 May 2004 Process effects in flare measurement

Pary Baluswamy, Linda Somerville

Proceedings Volume 5377, Optical Microlithography XVII; (2004) https://doi.org/10.1117/12.535474
Event: Microlithography 2004, 2004, Santa Clara, California, United States

Abstract

Flare has become a significant problem for low K1 lithography. Several authors have reported measurement of flare in projection lenses. Most of the work is based on the Flagello-Kirk method using resist clearing dose. To measure the flare reliably and accurately using this method the contribution of the process needs to be understood. In this paper we present data looking at the influence of such effects on the measured flare.

Citation Download Citation

Pary Baluswamy and Linda Somerville "Process effects in flare measurement", Proc. SPIE 5377, Optical Microlithography XVII, (28 May 2004); https://doi.org/10.1117/12.535474

ACCESS THE FULL ARTICLE

INSTITUTIONAL
Select your institution to access the SPIE Digital Library.

SELECT YOUR INSTITUTION

PERSONAL
Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.

PERSONAL SIGN IN

No SPIE Account? Create one

PURCHASE THIS CONTENT

SUBSCRIBE TO DIGITAL LIBRARY

50 downloads per 1-year subscription

Members: $195

Non-members: $335 ADD TO CART

25 downloads per 1 - year subscription

Members: $145

Non-members: $250 ADD TO CART

PURCHASE SINGLE ARTICLE

Includes PDF, HTML & Video, when available