Paper
21 July 2004 Thermomechanical behavior of Cu-Al-Ni single crystal high-temperature shape memory alloy: reorientation
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Abstract
Copper-Aluminum-Nickel (Cu-Al-Ni) single crystal shape memory alloy (SMA) wires show great potential in actuator applications due to their high stress-free transformation temperatures and superior mechanical stability compared to common Nickel-Titanium SMAs. In this paper, Cu-13.3%Al-4%Ni (wt %) single crystal wires with stress-free transformation temperatures in the range of 80° C to 120° C were subjected to stress cycling tests at ambient temperatures up to 100° C at low deformation rates. Stress/strain curves up to 9% and 3% strain in the range of the transformation temperatures point to the possibility of phase transformation by detwinning. However, the residual overall strain after unloading decreased significantly at 60° C for both 3% and 9% strains. Accumulation of plastic deformation was observed for subsequent cycles.
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Steve Trigwell, Ganesh Kumara Kannarpady, Abhijit Bhattacharyya, Sergei Pulnev, and Ivan Vahhi "Thermomechanical behavior of Cu-Al-Ni single crystal high-temperature shape memory alloy: reorientation", Proc. SPIE 5387, Smart Structures and Materials 2004: Active Materials: Behavior and Mechanics, (21 July 2004); https://doi.org/10.1117/12.539834
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KEYWORDS
Shape memory alloys

Crystals

Aluminum

Temperature metrology

Crystallography

Heat treatments

Thermal effects

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