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1 September 2004 3D heterogeneous sensor system on a chip for defense and security applications
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This paper describes a new concept for ultra-small, ultra-compact, unattended multi-phenomenological sensor systems for rapid deployment, with integrated classification-and-decision-information extraction capability from a sensed environment. We discuss a unique approach, namely a 3-D Heterogeneous System on a Chip (HSoC) in order to achieve a minimum 10X reduction in weight, volume, and power and a 10X or greater increase in capability and reliability -- over the alternative planar approaches. These gains will accrue from (a) the avoidance of long on-chip interconnects and chip-to-chip bonding wires, and (b) the cohabitation of sensors, preprocessing analog circuitry, digital logic and signal processing, and RF devices in the same compact volume. A specific scenario is discussed in detail wherein a set of four types of sensors, namely an array of acoustic and seismic sensors, an active pixel sensor array, and an uncooled IR imaging array are placed on a common sensor plane. The other planes include an analog plane consisting of transductors and A/D converters. The digital processing planes provide the necessary processing and intelligence capability. The remaining planes provide for wireless communications/networking capability. When appropriate, this processing and decision-making will be accomplished on a collaborative basis among the distributed sensor nodes through a wireless network.
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Shekhar Bhansali, Glenn H. Chapman, Eby G. Friedman, Yehea Ismail, P. R. Mukund, Dennis Tebbe, and Vijay K. Jain "3D heterogeneous sensor system on a chip for defense and security applications", Proc. SPIE 5417, Unattended/Unmanned Ground, Ocean, and Air Sensor Technologies and Applications VI, (1 September 2004);

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