DUV ALTA system aerial image enhancement for improved pattern fidelity: phase II

Michael E. Ungureit; Samuel C. Howells; T. Chabreck; J. Hubbard; Asher Klatchko; Peter Y. Pirogovsky; Robin L. Teitzel; Andrew Berwick; B. Skyborg; Paul C. Allen; Cris G. Morgante; Michael White

doi:10.1117/12.557806

20 August 2004 DUV ALTA system aerial image enhancement for improved pattern fidelity: phase II

Michael E. Ungureit, Samuel C. Howells, T. Chabreck, J. Hubbard, Asher Klatchko, Peter Y. Pirogovsky, Robin L. Teitzel, Andrew Berwick, B. Skyborg, Paul C. Allen, Cris G. Morgante, Michael White

Author Affiliations +

Proceedings Volume 5446, Photomask and Next-Generation Lithography Mask Technology XI; (2004) https://doi.org/10.1117/12.557806
Event: Photomask and Next Generation Lithography Mask Technology XI, 2004, Yokohama, Japan

Abstract

The ALTA 4300 system has been used to successfully write many advanced designs previously only possible with 50kV VSB systems. In order to further enlarge the application space of this high productivity system, an aerial image enhancement technique has been developed to deliver mask patterns that more closely match the pattern data for corners and jogs. This image enhancement is done in real time in the ALTA system's rasterizer by modifying the gray level mapping of pixels near the corner vertexes. SEM measurements of corner rounding with standard rasterization and the enhanced rasterization show a 35% improvement of corner rounding radius from ~205 to ~132 nm. A direct comparison of SEM micrographs show little qualitative difference between vector scan mask features and those written with aerial image enhancement. This convincingly demonstrates that the ALTA 4300 system with the new image enhancement can write many layers requiring vector scan corner acuity.

Citation Download Citation

Michael E. Ungureit, Samuel C. Howells, T. Chabreck, J. Hubbard, Asher Klatchko, Peter Y. Pirogovsky, Robin L. Teitzel, Andrew Berwick, B. Skyborg, Paul C. Allen, Cris G. Morgante, and Michael White "DUV ALTA system aerial image enhancement for improved pattern fidelity: phase II", Proc. SPIE 5446, Photomask and Next-Generation Lithography Mask Technology XI, (20 August 2004); https://doi.org/10.1117/12.557806

ACCESS THE FULL ARTICLE

INSTITUTIONAL
Select your institution to access the SPIE Digital Library.

SELECT YOUR INSTITUTION

PERSONAL
Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.

PERSONAL SIGN IN

No SPIE Account? Create one

PURCHASE THIS CONTENT

SUBSCRIBE TO DIGITAL LIBRARY

50 downloads per 1-year subscription

Members: $195

Non-members: $335 ADD TO CART

25 downloads per 1 - year subscription

Members: $145

Non-members: $250 ADD TO CART

PURCHASE SINGLE ARTICLE

Includes PDF, HTML & Video, when available