Results from a new die-to-database reticle inspection platform

William H. Broadbent; James N. Wiley; Zain K. Saidin; Sterling G. Watson; David S. Alles; Larry S. Zurbrick; Chris A. Mack

doi:10.1117/12.557784

20 August 2004 Results from a new die-to-database reticle inspection platform

William H. Broadbent, James N. Wiley, Zain K. Saidin, Sterling G. Watson, David S. Alles, Larry S. Zurbrick, Chris A. Mack

Author Affiliations +

Proceedings Volume 5446, Photomask and Next-Generation Lithography Mask Technology XI; (2004) https://doi.org/10.1117/12.557784
Event: Photomask and Next Generation Lithography Mask Technology XI, 2004, Yokohama, Japan

Abstract

A new DUV die-to-database high-resolution reticle defect inspection platform has been developed. This platform is designed to meet the 90nm through 65nm node 248/193nm lithography reticle qualification requirements of the IC industry. These design nodes typically include: COG layers, EPSM layers, and AltPSM layers, plus aggressive OPC which includes jogs, serifs, and SRAF (sub-resolution assist features). The architecture and technology of the new inspection platform is described. Die-to-database inspection results are shown on standard programmed defect test reticles, as well as, advanced 90nm through 65nm node reticles from industry sources. Results show high sensitivity and low false detections being achieved.

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William H. Broadbent, James N. Wiley, Zain K. Saidin, Sterling G. Watson, David S. Alles, Larry S. Zurbrick, and Chris A. Mack "Results from a new die-to-database reticle inspection platform", Proc. SPIE 5446, Photomask and Next-Generation Lithography Mask Technology XI, (20 August 2004); https://doi.org/10.1117/12.557784

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