The study of the acrylic material drilling used by the CO2 laser

Ming-Fei Chen; Yu-Pin Chen; W.-T. Hsiao

doi:10.1117/12.549017

20 September 2004 The study of the acrylic material drilling used by the CO₂ laser

Ming-Fei Chen, Yu-Pin Chen, W.-T. Hsiao

Proceedings Volume 5448, High-Power Laser Ablation V; (2004) https://doi.org/10.1117/12.549017
Event: High-Power Laser Ablation, 2004, Taos, New Mexico, United States

Abstract

Laser processing which used in the 3C industry is the new technology. The PCB (printed circuit board) Laser drilling is the new manufacturing process for the PCB industry. In this paper we report the results of an investigation exploring the feasibility of laser drilling microvias. The process relies on the use of pulses from a CO₂ laser to drilling small holes in the panels of acrylic. There are two part of this paper, first we will drilling the small holes of the acrylic by the different parameter of the laser (pulse width, repetitive frequency, mask size and etc.). There are two result of this paper; first we find the repetitive frequency and mask size will be change the holes diameter and depth, and the pulse width will affect the quality of the drilling holes. In Addition we can find the optimal process parameter by this paper.

Citation Download Citation

Ming-Fei Chen, Yu-Pin Chen, and W.-T. Hsiao "The study of the acrylic material drilling used by the CO₂ laser", Proc. SPIE 5448, High-Power Laser Ablation V, (20 September 2004); https://doi.org/10.1117/12.549017

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