Flip-chip assembly and reliability using gold/tin solder bumps

Hermann Oppermann; Matthias Hutter; Matthias Klein; Herbert Reichl

doi:10.1117/12.546463

8 September 2004 Flip-chip assembly and reliability using gold/tin solder bumps

Hermann Oppermann, Matthias Hutter, Matthias Klein, Herbert Reichl

Proceedings Volume 5454, Micro-Optics: Fabrication, Packaging, and Integration; (2004) https://doi.org/10.1117/12.546463
Event: Photonics Europe, 2004, Strasbourg, France

Abstract

Au/Sn solder bumps are commonly used for flip chip assembly of optoelectronic and RF devices. They allow a fluxless assembly which is required to avoid contamination at optical interfaces. Flip chip assembly experiments were carried out using as plated Au/Sn bumps without prior bump reflow. An RF and reliability test vehicles comprise a GaAs chip which was flip chip soldered on a silicon substrate. Temperature cycling tests with and without underfiller were performed and the results are presented. The different failure modes for underfilled and non-underfilled samples were discussed and compared. Additional reliability tests were performed with flip chip bonding by gold thermocompression for comparison. The test results and the failure modes are discussed in detail.

Citation Download Citation

Hermann Oppermann, Matthias Hutter, Matthias Klein, and Herbert Reichl "Flip-chip assembly and reliability using gold/tin solder bumps", Proc. SPIE 5454, Micro-Optics: Fabrication, Packaging, and Integration, (8 September 2004); https://doi.org/10.1117/12.546463

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