Advanced FPA technology development at CMC Electronics

Mike Davis; John W. Devitt; Mark E. Greiner; Rich Rawe; A. Timlin; David R. Wade

doi:10.1117/12.565665

21 October 2004 Advanced FPA technology development at CMC Electronics

Mike Davis, John W. Devitt, Mark E. Greiner, Rich Rawe, A. Timlin, David R. Wade

Proceedings Volume 5563, Infrared Systems and Photoelectronic Technology; (2004) https://doi.org/10.1117/12.565665
Event: Optical Science and Technology, the SPIE 49th Annual Meeting, 2004, Denver, Colorado, United States

Abstract

CMC Electronics Cincinnati (CMC) is now in production on 1Kx1K InSb focal plane arrays (FPAs), and continuing efforts on a third production run of 2Kx2K large format IR FPAs. These FPAs are based on our unique reticulated InSb architecture that has been shown to be inherently scalable across format size while maintaining performance properties. Performance in the 10mk to 15mk NETD range will be shown. The design and fabrication of these advanced FPAs has challenged the state of the art in fabrication processing, testing, and qualification of both InSb detectors and silicon ROICs. Program sponsored manufacturing improvement activities, as well as CMC internal R&D, continue to improve both the yields and the performance characteristics of these large arrays. The latest yield, operability, and performance data will be shown. Data will be drawn from a population of approximately 30 2Kx2K FPAs and 50 1Kx1K FPAs. A novel approach to rapid thermal cycling FPAs will we described and recent developments that enable the fabrication of reticulated, smaller pixel pitch devices and practical Ultra Large Format FPAs with additional capability and features will be discussed.

Citation Download Citation

Mike Davis, John W. Devitt, Mark E. Greiner, Rich Rawe, A. Timlin, and David R. Wade "Advanced FPA technology development at CMC Electronics", Proc. SPIE 5563, Infrared Systems and Photoelectronic Technology, (21 October 2004); https://doi.org/10.1117/12.565665

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