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6 December 2004 Defect printability and inspection of EUVL mask
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Defect printability and inspection studies were conducted on a programmed EUV defect mask. The mask was fabricated using Ta-based absorber stack on a Mo/Si multilayer coated 6025 plate. The defect pattern contains a variety of types of defects. The defect printing was performed on the Engineering Test Stand (ETS), which is the 0.1 NA EUV scanner at Sandia National Laboratories in Livermore, CA. The result showed that the printability of defects depended on the defect type and that either notches in or protrusions from absorber lines were the first to print. The minimum printable defect size was approximately 15 nm (1X). Defect inspection was performed on a 257-nm wavelength mask inspection system in die-to-die mode. Seventy-eight out of 120 programmed defects were detected when using 50% detection sensitivity. Maximum detection sensitivity was also tried. However, the number of defects is overwhelmed by the nuisance defects. The minimum defect detected was 52 nm in width. Simulations with a 2-D scalar model are used to verify the results.
© (2004) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Bing Lu, James R. Wasson, Pawitter J.S. Mangat, Jonathan L. Cobb, Scott D. Hector, Donald W. Pettibone, and Donna O'Connell "Defect printability and inspection of EUVL mask", Proc. SPIE 5567, 24th Annual BACUS Symposium on Photomask Technology, (6 December 2004);

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