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6 December 2004 First photomask developer based on state of the art wafer processing technology
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The challenges, mask manufacturing is faced with, are more and more dominating the semiconductor industry as the pattern sizes shrink. Today's mask patterns have reached sizes that are common in wafer manufacturing. Looking into the industry, we can see that some of the quality parameters - such as CD uniformity and defect control - are managed better in wafer than in mask manufacturing. Consequently, mask manufacturers have started to apply more wafer processing techniques to mask processes. Among others, develop process has a great impact on the quality of the mask manufacturing. This contribution describes how Tokyo Electron Limited (TEL) scanning (linear drive nozzle) developer processing (widely used in advanced wafer manufacturing) was adapted for mask development. Out of this technology transfer, a new alpha-type mask develop tool was launched at TEL and an evaluation of this tool was carried out at the Advanced Mask Technology Center (AMTC), Dresden, Germany. Target of this collaboration was to successfully transfer wafer processing technology to mask making. By this, valuable information was generated, that has been implemented into the production platform, which is commercialized since first half of 2004.
© (2004) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Peter Tichy, Takahiro Fukai, Shigenori Kamei, Hiroshi Asai, Tatsuhito Kotoda, Kazuhiro Takeshita, Tetsushi Miyamoto, Yoshiki Okamoto, Hideo Funakoshi, Shinji Koga, Shigemi Oono, Rusty Cantrell, Axel Feicke, Wolfram Porsche, Martin Tschinkl, and Gaston Lee "First photomask developer based on state of the art wafer processing technology", Proc. SPIE 5567, 24th Annual BACUS Symposium on Photomask Technology, (6 December 2004);

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