Paper
6 December 2004 Simple method for restricting OPC model minimum spacing and width for a no-failure imaging solution
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Abstract
Optical proximity correction (OPC) procedure for modifying designs requires an OPC setting effectively accounting for manufacturing and imaging constraints. Reticle-writing and imaging tool capabilities drive the choice for the minimum feature of an OPC model. Aggressiveness of an optical proximity correction is determined by a discretization setting for an OPC algorithm. Some OPC scheme parameters are there to restrict the minimum spacing and width to avoid circuit failures. The OPC minimum spacing parameter controls bridging lines. The OPC minimum width parameter limits the correction of trenches responsible for circuit breakdown. An aggressive choice of minimum spacing and width for an OPC setting can results in circuit failure: shortage or breakdown. The conservative approach results in poor circuit performance. The methodology was deployed at LSI Logic Corporation for empirical optimization of the OPC minimum spacing/width settings for a no failure imaging solution of OPCed masks. The proposed procedure is particularly beneficial for dark field metal interconnect masks. The approach was successfully validated for 130nm and 90nm backend technology metal layers.
© (2004) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Nadya Belova and Neal P. Callan "Simple method for restricting OPC model minimum spacing and width for a no-failure imaging solution", Proc. SPIE 5567, 24th Annual BACUS Symposium on Photomask Technology, (6 December 2004); https://doi.org/10.1117/12.569640
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CITATIONS
Cited by 1 scholarly publication.
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KEYWORDS
Optical proximity correction

Reticles

Scanning electron microscopy

Logic

Semiconducting wafers

Control systems

Fourier transforms

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