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9 December 2004 Scanning white light interferometry in quality control of single-point tape automated bonding
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Abstract
We report on using a Scanning White Light Interferometer (SWLI) for quality control of aluminum lead single-point Tape Automated Bonding (spTAB). A spTAB process was used to connect 14 μm thick, 42 μm wide aluminum leads on a 12 μm thick polyimide layer to a micro chip. Three different bonding process parameters were varied in order to maximize the pull force: bond force, ultrasonic power, and ultrasonic time. A custom built SWLI was used to measure the topography of the bonds in order to find features that correlate with the tensile bond force. This force was obtained in a destructive way by a pull test. By keeping the bond height within 3±1.5 μm, bonds with acceptable tensile forces in excess of 54 mN were obtained. This was verified by a separate validation measurement where the pull force of bonds complying with the height requirement was recorded.
© (2004) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Henri Seppanen, Ivan I. K. Kassamakov, Markku Oinonen, Edward Hæggstrom, Juha P. Aaltonen, Zoran Radivojevic, and Mathias Osterberg "Scanning white light interferometry in quality control of single-point tape automated bonding", Proc. SPIE 5578, Photonics North 2004: Photonic Applications in Astronomy, Biomedicine, Imaging, Materials Processing, and Education, (9 December 2004); https://doi.org/10.1117/12.567064
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