Scanning white light interferometry in quality control of single-point tape automated bonding

Henri Seppanen; Ivan I. K. Kassamakov; Markku Oinonen; Edward Hæggstrom; Juha P. Aaltonen; Zoran Radivojevic; Mathias Osterberg

doi:10.1117/12.567064

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9 December 2004 Scanning white light interferometry in quality control of single-point tape automated bonding

Henri Seppanen, Ivan I. K. Kassamakov, Markku Oinonen, Edward Hæggstrom, Juha P. Aaltonen, Zoran Radivojevic, Mathias Osterberg

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Proceedings Volume 5578, Photonics North 2004: Photonic Applications in Astronomy, Biomedicine, Imaging, Materials Processing, and Education; (2004) https://doi.org/10.1117/12.567064
Event: Photonics North, 2004, Ottawa, Ontario, Canada

Abstract

We report on using a Scanning White Light Interferometer (SWLI) for quality control of aluminum lead single-point Tape Automated Bonding (spTAB). A spTAB process was used to connect 14 μm thick, 42 μm wide aluminum leads on a 12 μm thick polyimide layer to a micro chip. Three different bonding process parameters were varied in order to maximize the pull force: bond force, ultrasonic power, and ultrasonic time. A custom built SWLI was used to measure the topography of the bonds in order to find features that correlate with the tensile bond force. This force was obtained in a destructive way by a pull test. By keeping the bond height within 3±1.5 μm, bonds with acceptable tensile forces in excess of 54 mN were obtained. This was verified by a separate validation measurement where the pull force of bonds complying with the height requirement was recorded.

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Henri Seppanen, Ivan I. K. Kassamakov, Markku Oinonen, Edward Hæggstrom, Juha P. Aaltonen, Zoran Radivojevic, and Mathias Osterberg "Scanning white light interferometry in quality control of single-point tape automated bonding", Proc. SPIE 5578, Photonics North 2004: Photonic Applications in Astronomy, Biomedicine, Imaging, Materials Processing, and Education, (9 December 2004); https://doi.org/10.1117/12.567064

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