Design and fabrication of heat sink with impedance matching circuit for high-speed EA modulators

Jianbo Tian; Bing Xiong; Lijiang Zhang; Qin Wan; Zhizhi Liu; Jian Wang; Changzheng Sun; Yi Luo

doi:10.1117/12.575526

17 January 2005 Design and fabrication of heat sink with impedance matching circuit for high-speed EA modulators

Jianbo Tian, Bing Xiong, Lijiang Zhang, Qin Wan, Zhizhi Liu, Jian Wang, Changzheng Sun, Yi Luo

Proceedings Volume 5644, Optoelectronic Devices and Integration; (2005) https://doi.org/10.1117/12.575526
Event: Photonics Asia, 2004, Beijing, China

Abstract

Heat sinks with impedance matching circuit have been designed and fabricated for the packaging of high-speed electroabsorption (EA) modulators. Ti/Cu/Ni/Au metallization system is adopted for the coplanar waveguide (CPW) electrodes and a 50-ohm Ta₂N thin-film resistor in parallel with the EA modulator is used for impedance matching. By a matching resistance optimization, a reflection coefficient S11 better than -21 dB has been demonstrated up to 40 GHz. The heat sinks are applied successfully in the 40 GHz Modulator packaging.

Citation Download Citation

Jianbo Tian, Bing Xiong, Lijiang Zhang, Qin Wan, Zhizhi Liu, Jian Wang, Changzheng Sun, and Yi Luo "Design and fabrication of heat sink with impedance matching circuit for high-speed EA modulators", Proc. SPIE 5644, Optoelectronic Devices and Integration, (17 January 2005); https://doi.org/10.1117/12.575526

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