Fabrication of micro-conductive patterns using laser ablation and selective electroless Ni-B plating

Hyoung-Shik Kang; Hye-won Kim; Soon-Kug Hong; Jae Hoon Lee; Dong Sig Shin; Sung Goon Kang

doi:10.1117/12.596556

8 October 2004 Fabrication of micro-conductive patterns using laser ablation and selective electroless Ni-B plating

Hyoung-Shik Kang, Hye-won Kim, Soon-Kug Hong, Jae Hoon Lee, Dong Sig Shin, Sung Goon Kang

Proceedings Volume 5662, Fifth International Symposium on Laser Precision Microfabrication; (2004) https://doi.org/10.1117/12.596556
Event: Fifth International Symposium on Laser Precision Microfabrication, 2004, Nara, Japan

Abstract

Micro-conductive patterns formed by selective electroless Ni-B plating process were fabricated to investigate the various distribution of the seed layer on insulating substrates. Selective distribution of the seed layer was forming through successive steps of laser ablation, activation treatment, mechanical polishing. A KrF Excimer laser (wavelength of 248 nm) ablation was carried out on the PMMA (Polymethymethacrylate), PET (Polyethylene Terephalate), PC (Polycarbonate) and PI (Polyimide substrates. The UV-vis spectrometer analysis showed that PMMA was a weaker absorber than other polymers at the wavelength of 248 nm. The geometrical shape of structure formed is affected by absorption coefficient. Surface morphology and characteristics after laser ablation and electroless plating is observed by Field Emission Scanning Electro Microscope (FE-SEM). As a increasing the depth of substrate patterned by laser ablation, plating was precise. Finally, we concluded this method to be suited for manufacturing micro-conductive patterns on insulating substrates without lithography.

Citation Download Citation

Hyoung-Shik Kang, Hye-won Kim, Soon-Kug Hong, Jae Hoon Lee, Dong Sig Shin, and Sung Goon Kang "Fabrication of micro-conductive patterns using laser ablation and selective electroless Ni-B plating", Proc. SPIE 5662, Fifth International Symposium on Laser Precision Microfabrication, (8 October 2004); https://doi.org/10.1117/12.596556

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