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12 April 2005 LIPAA technique and its possible impact on microelectronics (Invited Paper)
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The laser-induced plasma-assisted ablation (LIPAA) process developed by our group, in which a single conventional pulsed laser is only used, makes it possible to perform high-quality and high-speed glass microfabrication. Up to the present, this process has been widely applied for micromachining of various transparent hard and soft materials. In this process, a laser beam is first directed to a glass substrate placed in vacuum or air. The laser beam passes through the substrate since the wavelength of the laser beam must have no absorption by the substrate for the LIPAA process. The transmitted laser beam is absorbed by a solid target (typically a metal), located behind the substrate. The target is then ablated, resulting in plasma generation. Due to the interaction of the laser beam and the laser-induced plasma, significant ablation takes place at the rear surface of the substrate. Recently, we have developed the proto-type LIPAA system using a second harmonic of diode pumped Q-switched Nd:YAG laser for the practical use. In this paper, we will demonstrate micromachining, crack-free marking, color marking and dicing of glass materials. Additionally, selective metallization of glass and polyimide by the LIPAA process followed by metal chemical-plating is investigated. The discussion includes mechanism and practical applications in micro-electronics industry of the LIPAA process.
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Yasutaka Hanada, Koji Sugioka, Iwao Miyamoto, and Katsumi Midorikawa "LIPAA technique and its possible impact on microelectronics (Invited Paper)", Proc. SPIE 5713, Photon Processing in Microelectronics and Photonics IV, (12 April 2005);

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