Laser technology for wafer dicing and microvia drilling for next generation wafers

Richard F. Toftness; Adrian Boyle; David Gillen

doi:10.1117/12.602033

12 April 2005 Laser technology for wafer dicing and microvia drilling for next generation wafers (Invited Paper)

Richard F. Toftness, Adrian Boyle, David Gillen

Proceedings Volume 5713, Photon Processing in Microelectronics and Photonics IV; (2005) https://doi.org/10.1117/12.602033
Event: Lasers and Applications in Science and Engineering, 2005, San Jose, California, United States

Abstract

Laser micromaching systems are being used in mainstream high-volume semiconductor applications. Two of those processes, via drilling and thin wafer dicing, are discussed in this paper. Via drilling has been proven viable for forming through chip and blind vias. The inherent flexibility of the laser process makes it possible to control via depth, diameter and sidewall slope. As a mask-less process, laser via drilling can be cost affective and highly flexible in its application. Thin wafer dicing reduces the breakage and damage to thin silicon wafers. A new process has been developed that improves the die strength of laser singulated devices beyond that obtained using conventional sawing techniques.

Citation Download Citation

Richard F. Toftness, Adrian Boyle, and David Gillen "Laser technology for wafer dicing and microvia drilling for next generation wafers (Invited Paper)", Proc. SPIE 5713, Photon Processing in Microelectronics and Photonics IV, (12 April 2005); https://doi.org/10.1117/12.602033

ACCESS THE FULL ARTICLE

INSTITUTIONAL
Select your institution to access the SPIE Digital Library.

SELECT YOUR INSTITUTION

PERSONAL
Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.

PERSONAL SIGN IN

No SPIE Account? Create one

PURCHASE THIS CONTENT

SUBSCRIBE TO DIGITAL LIBRARY

50 downloads per 1-year subscription

Members: $195

Non-members: $335 ADD TO CART

25 downloads per 1 - year subscription

Members: $145

Non-members: $250 ADD TO CART

PURCHASE SINGLE ARTICLE

Includes PDF, HTML & Video, when available