Scope for electric field assisted removal of ablated debris from laser machined features in silicon

Edward Coyne; Paul Mannion; Gerard M. O'Connor; Sebastian Favre; Thomas J. Glynn

doi:10.1117/12.594529

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12 April 2005 Scope for electric field assisted removal of ablated debris from laser machined features in silicon

Edward Coyne, Paul Mannion, Gerard M. O'Connor, Sebastian Favre, Thomas J. Glynn

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Proceedings Volume 5713, Photon Processing in Microelectronics and Photonics IV; (2005) https://doi.org/10.1117/12.594529
Event: Lasers and Applications in Science and Engineering, 2005, San Jose, California, United States

Abstract

The problem created by the re-deposition of ablated material when laser machining structures in silicon wafers is investigated. The study focuses on the specific case of machining wafer grade silicon with femtosecond pulses centered at a wavelength of 775 nm. Based on the evidence that a highly ionised plasma state exists immediately after laser ablation, this work explores the potential of using electric fields to channel the debris out of the laser machined feature before it becomes deposited. To this extent the work discusses the step-by-step development of different experimental arrangements, by first evaluating its effects, then identifying its limitations and finally by proposing and investigating potential solutions. It is found that a reduction in the amount of re-deposited debris is observed when a carrier-depleted region is generated in silicon materials.

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Edward Coyne, Paul Mannion, Gerard M. O'Connor, Sebastian Favre, and Thomas J. Glynn "Scope for electric field assisted removal of ablated debris from laser machined features in silicon", Proc. SPIE 5713, Photon Processing in Microelectronics and Photonics IV, (12 April 2005); https://doi.org/10.1117/12.594529

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