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22 January 2005 Spatial light modulators with monocrystalline silicon micromirrors made by wafer bonding
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Abstract
Spatial light modulators (SLMs) based on micromirrors for use in DUV lithography and adaptive optics require very high mirror planarity as well as mirror stability. The ideal mechanical properties of monocrystalline silicon make this material ideally suited for use in high precision optical MEMS devices. However, the integration of MEMS with CMOS poses certain restrictions on processing temperatures as well as on the compatibility of materials. The key to the successful fabrication of monocrystalline silicon micromirrors on CMOS is the silicon layer transfer process. Here, we discuss two carefully adapted wafer bonding processes that are CMOS compatible and that allow the transfer of a 300nm thick monocrystalline silicon thin film from a SOI donor wafer. One process is based on adhesive bonding using a patterned polymer layer, while the other process is based on direct bonding to a planarization layer of polished glass.
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Thor Bakke, Martin Friedrichs, Benjamin Voelker, Manfred Reiche, Lars Leonardsson, Harald Schenk, and Hubert K. Lakner "Spatial light modulators with monocrystalline silicon micromirrors made by wafer bonding", Proc. SPIE 5715, Micromachining and Microfabrication Process Technology X, (22 January 2005); https://doi.org/10.1117/12.590567
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