Characterization of (near) hermetic zero-level packages for MEMS

Piet De Moor; Kris Baert; Ingrid De Wolf; Anne Jourdain; Harrie A. C. Tilmans; Ann Witvrouw; Chris A. Van Hoof

doi:10.1117/12.596190

22 January 2005 Characterization of (near) hermetic zero-level packages for MEMS

Piet De Moor, Kris Baert, Ingrid De Wolf, Anne Jourdain, Harrie A. C. Tilmans, Ann Witvrouw, Chris A. Van Hoof

Proceedings Volume 5716, Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS IV; (2005) https://doi.org/10.1117/12.596190
Event: MOEMS-MEMS Micro and Nanofabrication, 2005, San Jose, California, United States

Abstract

Zero-level packaging, i.e. the encapsulation of the MEMS device at wafer level, is an essential technique for MEMS miniaturization and cost reduction. A large number of different capping and sealing materials and techniques can be used. However, the testing and qualification of this type of packaging of MEMS devices requires special techniques. A number of conventional and new characterization techniques for mechanical and hermeticity testing are presented, as well as an overview about outgasing measurements and reliability testing.

Citation Download Citation

Piet De Moor, Kris Baert, Ingrid De Wolf, Anne Jourdain, Harrie A. C. Tilmans, Ann Witvrouw, and Chris A. Van Hoof "Characterization of (near) hermetic zero-level packages for MEMS", Proc. SPIE 5716, Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS IV, (22 January 2005); https://doi.org/10.1117/12.596190

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