Characterization of the mechanical properties of MEMS devices using nanoscale techniques

Nicholas X. Randall

doi:10.1117/12.592772

22 January 2005 Characterization of the mechanical properties of MEMS devices using nanoscale techniques

Nicholas X. Randall

Proceedings Volume 5716, Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS IV; (2005) https://doi.org/10.1117/12.592772
Event: MOEMS-MEMS Micro and Nanofabrication, 2005, San Jose, California, United States

Abstract

This paper focuses on recent developments in the localised characterisation of the mechanical properties of Microsystems and MEMS devices and structures. Conventional indentation techniques provide a highly powerful method for measuring the load and depth response of bulk and coated materials, but can also be used to measure the mechanical properties of very small micro-machined silicon structures. Beam structures, such as are used for accelerometers, need to be characterised in terms of the number of cycles to failure, the spring constant or the energy required to bend the beam by a required amount. Such localised testing needs to be adapted to work at various distances from the origin of the beam with a positioning accuracy of less than a micron. Initial studies have proved to be highly repeatable. A range of examples is presented which covers a range of application areas, including accelerometer beam structures, microswitches and printer head structures. The basic instrumental concepts are explained together with the modifications required for testing small structures in a localised way. In addition, the localised testing of friction and wear in MEMS devices will be covered with some examples of the technology available and how it may be applied to such small contact areas in an accurate and reproducible way.

Citation Download Citation

Nicholas X. Randall "Characterization of the mechanical properties of MEMS devices using nanoscale techniques", Proc. SPIE 5716, Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS IV, (22 January 2005); https://doi.org/10.1117/12.592772

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KEYWORDS

Microelectromechanical systems

Silicon

Coating

Microfabrication

Photomicroscopy

Resistance

Switches

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