Ultra-thin multi-element Si pin photodiode arrays for medical imaging applications

Bernd Tabbert; Christopher Hicks; Ed Bartley; Hong Wu; Richard Metzler; Alexander O. Goushcha

doi:10.1117/12.589486

7 April 2005 Ultra-thin multi-element Si pin photodiode arrays for medical imaging applications

Bernd Tabbert, Christopher Hicks, Ed Bartley, Hong Wu, Richard Metzler, Alexander O. Goushcha

Proceedings Volume 5726, Semiconductor Photodetectors II; (2005) https://doi.org/10.1117/12.589486
Event: Integrated Optoelectronic Devices 2005, 2005, San Jose, California, United States

Abstract

Results of comparative studies of opto-electrical properties of photodiode arrays built on 30-um, 75-um, and 100-um thick single Silicon dies are presented. The size of the square pixels varied from 1.5 mm to 250-um for different arrays with the gaps between adjacent elements as small as 20 um. The internal quantum efficiency was close to 100%, DC and AC cross talks were smaller than 0.01% within the spectral range 400 to 800 nm. The arrays were characterized with very low leakage currents and high shunt resistance - above 1 GΩhm. The features of the array structure are discussed for the first time.

Citation Download Citation

Bernd Tabbert, Christopher Hicks, Ed Bartley, Hong Wu, Richard Metzler, and Alexander O. Goushcha "Ultra-thin multi-element Si pin photodiode arrays for medical imaging applications", Proc. SPIE 5726, Semiconductor Photodetectors II, (7 April 2005); https://doi.org/10.1117/12.589486

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