Paper
10 May 2005 In field overlay uncertainty contributors
Author Affiliations +
Abstract
In this publication, the contributors to in-field overlay metrology uncertainty have been parsed and quantified in a specific case study. Particular focus is placed on the unmodeled systematics, i.e. the components which contribute to residuals in a linear model after removal of random errors. These are the contributors which are often the most challenging to quantify and are suspected to be significant in the model residuals. The results show that even in a relatively "clean" front end process, the unmodeled systematics are the dominant residual contributor, accounting for 60 to 70% of the variance. Given the above results, new sampling and modeling methods are proposed which have the potential to improve the accuracy of modeled correctibles and lot dispositioning parameters.
© (2005) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Aviv Frommer, Elyakim Kassel, Pavel Izikson, Mike Adel, Philippe Leray, and Bernd Schulz "In field overlay uncertainty contributors", Proc. SPIE 5752, Metrology, Inspection, and Process Control for Microlithography XIX, (10 May 2005); https://doi.org/10.1117/12.599397
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Cited by 5 scholarly publications.
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KEYWORDS
Reticles

Overlay metrology

Semiconducting wafers

Scanners

Dysprosium

Metrology

Data modeling

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