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31 May 2005 Hybrid micropackaging technology for uncooled FPAs
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Abstract
A novel concept for low-cost, wafer-level packaging of MEMS is proposed and applied to vacuum packaging of INO's 160x120 pixel uncooled bolometric focal plane arrays, FPAs, based on vanadium oxide as thermistor material. The wafer-scale fabrication of both metallic and ceramic micropackages is described. In the former case, a nickel tray composed of several tens of micropackages is electroplated by using a thick negative resist as micromold. In the latter case, micropackages are fabricated from up to 1 mm-thick, polished, laser machined alumina wafers equipped with solderable layers and solder seals. FPA dies and infrared windows are then soldered to the main tray by thermo-compression bonding. Contrary to the conventional wafer-to-wafer bonding approach, assembly and vacuum sealing steps are dissociated. For that purpose, each micropackage is equipped with a pump-out hole for outgassing prior to vacuum sealing. To monitor in-situ pressure changes within the sealed microcavity, micromachined pressure sensors were specifically designed for thermal conductance measurements. The initial characterization of dies after assembly in the metallic micropackage is presented.
© (2005) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
P. Topart, C. Alain, L. LeNoc, S. Leclair, Y. Desroches, B. Tremblay, and H. Jerominek "Hybrid micropackaging technology for uncooled FPAs", Proc. SPIE 5783, Infrared Technology and Applications XXXI, (31 May 2005); https://doi.org/10.1117/12.605108
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