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24 May 2005 High-density, end-to-end optoelectronic integration and packaging for digital-optical interconnect systems (Invited Paper)
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Abstract
Recent progress toward implementing high-density, optical-digital building blocks necessary to accomplish efficient, end-to-end optical interconnect architecture on low cost FR-4 boards has been demonstrated. The optical interconnect system consists of fabricating an optical buffer layer separating board metallurgy from the optical lightwave circuit layer, and implementing optical links between embedded lasers and detectors. We will show an example of 1310 nm light from an edge emitting distributed-feedback or Fabry-Perot laser operating at 10 Gb/s being guided to the photo-detector by a polymer waveguide. Both lasers and detector are embedded in the waveguide and all construction is built on a low-cost FR-4 board with 3 levels of metallurgy.
© (2005) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Gee-Kung Chang, Daniel Guidotti, Zhaoran Rena Huang, Lixi Wan, Jianjun Yu, Shashikant Hegde, Hung-Fei Kuo, Yin-Jung Chang, Fuhan Liu, Fentao Wang, and Rao Tummala "High-density, end-to-end optoelectronic integration and packaging for digital-optical interconnect systems (Invited Paper)", Proc. SPIE 5814, Enabling Photonics Technologies for Defense, Security, and Aerospace Applications, (24 May 2005); https://doi.org/10.1117/12.606958
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