Ultrasonic weak bond evaluation in IC packaging

Xiaoming Jian; N. Guo; Steve Dixon

doi:10.1117/12.621561

12 April 2005 Ultrasonic weak bond evaluation in IC packaging

Xiaoming Jian, N. Guo, Steve Dixon

Proceedings Volume 5852, Third International Conference on Experimental Mechanics and Third Conference of the Asian Committee on Experimental Mechanics; (2005) https://doi.org/10.1117/12.621561
Event: Third International Conference on Experimental Mechanics and Third Conference of the Asian Committee on Experimental Mechanics, 2004, -, Singapore

Abstract

Air gap such as disbond and crack can be successfully detected by ultrasonic testing. But imperfect interface evaluation is still a challenge. The challenge arises from the uncertainty of formation mechanism, boundary condition and acoustical response. In the paper, samples of structure silicon/adhesive/lead-frame, typical in IC packaging, are fabricated with two adhesives, degraded through thermo cycling, examined by acoustical waveform and C-imaging, and compared to the measured optical microscopy image and the measured failure shear strength.

Citation Download Citation

Xiaoming Jian, N. Guo, and Steve Dixon "Ultrasonic weak bond evaluation in IC packaging", Proc. SPIE 5852, Third International Conference on Experimental Mechanics and Third Conference of the Asian Committee on Experimental Mechanics, (12 April 2005); https://doi.org/10.1117/12.621561

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