Paper
12 April 2005 Vibration analysis of gyro sensors by using ESPI technique
Seon-il Ham, Jae-huk Lee, Sang-duck Park
Author Affiliations +
Proceedings Volume 5852, Third International Conference on Experimental Mechanics and Third Conference of the Asian Committee on Experimental Mechanics; (2005) https://doi.org/10.1117/12.621488
Event: Third International Conference on Experimental Mechanics and Third Conference of the Asian Committee on Experimental Mechanics, 2004, -, Singapore
Abstract
Recently, micro gyroscope sensors are adopted in handy camcorders to compensate external shock or vibration such as hand shakes. In developing micro gyroscope sensors, vibration analysis is inevitable but not easy since the micro gyroscope sensors are too small. In this paper, non-contact full-field ESPI (Electronic speckle pattern interferometry) measurement technique is introduced in vibration analysis of micro gyroscope sensors. Resonant frequencies and ODS(Operational deflection shapes) are measured and compared to each other. It is found that structure and PCB molding mass is one of most sensitive factors in designing micro gyroscope sensors.
© (2005) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Seon-il Ham, Jae-huk Lee, and Sang-duck Park "Vibration analysis of gyro sensors by using ESPI technique", Proc. SPIE 5852, Third International Conference on Experimental Mechanics and Third Conference of the Asian Committee on Experimental Mechanics, (12 April 2005); https://doi.org/10.1117/12.621488
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Cited by 1 scholarly publication.
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KEYWORDS
Sensors

Gyroscopes

Vibrometry

Speckle pattern

Laser Doppler velocimetry

Lead

Electronics

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