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13 June 2005 Assessment of technology and (thermo)mechanical behaviour of MEMS devices by interference microscopy (Invited Paper)
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Abstract
Microelectromechanical systems (MEMS) are based on the generation and/or detection of deformations, motion and vibrations of thin mechanical structures having lateral dimensions in the micrometer to millimeter range. A number of technological issues commonly appear during the development of MEMS fabrication processes such as non uniform etching or deposition, surface roughening, stiction and stress-induced deformations. Likewise, as mechanical properties of thin films are difficult to predict, and are very variable with process parameters. Consequently, experimental data on the (thermo)mechanical and dynamical behaviour of MEMS and on their reliability are often required. In this paper, after a short description of the basic principles and performances of interference microscopy techniques, we review the capabilities of full field interference microscopy techniques for these applications. They are illustrated by various examples taken during the development of MEMS fabrication and packaging processes, and by results of measurements as function of temperature or under vacuum.
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Alain Bosseboeuf, Cedric Breluzeau, and Sylvain Petitgrand "Assessment of technology and (thermo)mechanical behaviour of MEMS devices by interference microscopy (Invited Paper)", Proc. SPIE 5856, Optical Measurement Systems for Industrial Inspection IV, (13 June 2005); https://doi.org/10.1117/12.621584
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