Paper
12 October 2005 Electro thermal analysis of rotary type micro thermal actuator
M. Arefin Anwar, Muthukumaran Packirisamy, A. K. Waiz Ahmed
Author Affiliations +
Abstract
In micro domain, thermal actuators are favored because it provides higher force and deflection than others. This paper presents a new type of micro thermal actuator that provides rotary motion of the circular disc shaped cold arm, which can be used in various optical applications, such as, switching, attenuation, diffraction, etc. The device has been fabricated in MUMPS technology. In this new design, the hot arms are arranged with the cold disc in such a way that thermal expansion of the hot arms due to Joule heating, will make the cold disc to rotate and the rotation is unidirectional on loading. The dominant heat transfer modes in the operating temperature zone are through the anchor and the air between the structure and the substrate because of the very low gap provided by MUMPS. A mathematical model was used for predicting steady state temperature profile along the actuator length and rotational behavior of the cold disc under different applied voltages. A 3-D coupled field finite element analysis (FEM) for the device is also presented. A FEM analysis was done by defining an air volume around the structure and substrate below the structure. Results obtained from the mathematical model, was compared with that of the finite element analysis. The presented results confirm the applicability of this novel rotary type thermal actuator for many optical MEMS applications.
© (2005) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
M. Arefin Anwar, Muthukumaran Packirisamy, and A. K. Waiz Ahmed "Electro thermal analysis of rotary type micro thermal actuator", Proc. SPIE 5970, Photonic Applications in Devices and Communication Systems, 597015 (12 October 2005); https://doi.org/10.1117/12.628262
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Cited by 3 scholarly publications.
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KEYWORDS
Actuators

Finite element methods

Testing and analysis

Microopto electromechanical systems

Thermal analysis

Mathematical modeling

Silicon

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