A new architecture for board-level optical wirings applying optical pin and self-written waveguide

Osamu Mikami

doi:10.1117/12.629312

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24 October 2005 A new architecture for board-level optical wirings applying optical pin and self-written waveguide

Osamu Mikami

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Proceedings Volume 6014, Active and Passive Optical Components for WDM Communications V; 60140L (2005) https://doi.org/10.1117/12.629312
Event: Optics East 2005, 2005, Boston, MA, United States

Abstract

The potential of the optical circuit packaging technology is discussed. Special attention has been paid to introduction of "Optical wiring" into the Printed Wiring Board level ("last 1 meter area") to overcome conventional electrical copper-based bandwidth limitations. Optical Surface Mount Technology (O-SMT) can be one of possible solutions in this field is reviewed. High efficiency and alignment-free coupling between optical wirings and optical devices is a key. O-SMT requires a method to change the beam direction from the horizontal to the vertical and vice verse in order to couple between optical wirings in an OE-board and OE-devices mounted on the board. A novel method using an "Optical Pin" has been proposed and investigated. Furthermore, an optical coupling method using a Self-Written Waveguide called "Optical Solder" has been investigated. Several applications of self-written waveguides using a green-laser and a photo-mask are demonstrated.

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Osamu Mikami "A new architecture for board-level optical wirings applying optical pin and self-written waveguide", Proc. SPIE 6014, Active and Passive Optical Components for WDM Communications V, 60140L (24 October 2005); https://doi.org/10.1117/12.629312

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KEYWORDS

Waveguides

Ultraviolet radiation

Mirrors

Tolerancing

Connectors

UV optics

Vertical cavity surface emitting lasers

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