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7 February 2006 Packaged MEMS and MOEMS measurement using through-transmissive-media (TTM) profiler
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Proceedings Volume 6032, ICO20: MEMS, MOEMS, and NEMS; 603203 (2006) https://doi.org/10.1117/12.667846
Event: ICO20:Optical Devices and Instruments, 2005, Changchun, China
Abstract
Interferometric surface profiling, which combines high speed, accuracy, resolution and flexibility, has proven successful for measuring surface features of unpackaged MEMS (Micro-Electro-Mechanical Systems) and MOEMS (Micro-Opto-Electro-Mechanical Systems) devices. With the further productization of MEMS technology, however, devices also need to be tested in their final packaged state, typically beneath a protective, transparent cover. Objectives capable of imaging through transparent media at low magnifications have been available for several years. Increasingly, however, higher magnifications are required to resolve smaller critical features. At high magnifications, transmissive media can greatly degrade interferometric measurements due to dispersion and aberration effects. In this paper we describe an improved technique for measuring MEMS features through transmissive media, at magnifications as high as 40X. The technique enables improved dispersion compensation, reduced coherence effects, thickness variation insensitivity, and enhanced illumination. Measurement results are presented.
© (2006) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Sen Han "Packaged MEMS and MOEMS measurement using through-transmissive-media (TTM) profiler", Proc. SPIE 6032, ICO20: MEMS, MOEMS, and NEMS, 603203 (7 February 2006); https://doi.org/10.1117/12.667846
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