Paper
7 February 2006 Study of lag effect in LPHD plasma etching of Si for MEMS applications by variable time steps in numerical methods
Jian Zhang, Qing-An Huang, Wei-Hua Li
Author Affiliations +
Proceedings Volume 6032, ICO20: MEMS, MOEMS, and NEMS; 60320H (2006) https://doi.org/10.1117/12.667866
Event: ICO20:Optical Devices and Instruments, 2005, Changchun, China
Abstract
A simplified numerical model for two-dimensional etched profile evolution is developed based on dynamics of plasma~surface interactions. The Lag effect, which is an important phenomenon in plasma etching, is detected in fixed-aspect-ratio structures by this model. So it may provide aid to theory and experiment research of plasma etching. The setting of time steps in numerical simulations is also discussed in this paper and the optimal time steps are proposed and verified.
© (2006) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Jian Zhang, Qing-An Huang, and Wei-Hua Li "Study of lag effect in LPHD plasma etching of Si for MEMS applications by variable time steps in numerical methods", Proc. SPIE 6032, ICO20: MEMS, MOEMS, and NEMS, 60320H (7 February 2006); https://doi.org/10.1117/12.667866
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KEYWORDS
Etching

Ions

Plasma etching

Chlorine

Computer simulations

Silicon

Microelectromechanical systems

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