Micro hot embossed plastic millimeter-wave systems

Ying Cai; Firas Sammoura; Chen-Yu Chi; Liwei Lin; J.-C. Chiao

doi:10.1117/12.638259

5 January 2006 Micro hot embossed plastic millimeter-wave systems

Ying Cai, Firas Sammoura, Chen-Yu Chi, Liwei Lin, J.-C. Chiao

Proceedings Volume 6035, Microelectronics: Design, Technology, and Packaging II; 60350S (2006) https://doi.org/10.1117/12.638259
Event: Microelectronics, MEMS, and Nanotechnology, 2005, Brisbane, Australia

Abstract

Recently, millimeter-wave devices have been attracted more attentions in applications owing to their short wavelengths, higher resolutions, broader bandwidths and higher environmental tolerance. The great challenges of high fabrication and assembly costs, bulky volumes, and heavy weights of millimeter-wave systems call for new integrated manufacturing techniques. The hot embossing technique could address these challenges. In this paper, a review of micro plastic hot embossing was given for the fabrication of miniaturized millimeter-wave systems. The micro hot embossing on plastic materials demonstrated its advantages on significant costs, volume and weight reduction, while maintaining high performances. We have designed, fabricated and characterized a W-band rectangular waveguide and a W-band iris waveguide filter with integrated plastic flanges using micro hot embossing and selective electroplating. In this paper, we reviewed the results and discussed the design methodology in details for the micromachined components. The prototype devices showed promise for the system designs.

Citation Download Citation

Ying Cai, Firas Sammoura, Chen-Yu Chi, Liwei Lin, and J.-C. Chiao "Micro hot embossed plastic millimeter-wave systems", Proc. SPIE 6035, Microelectronics: Design, Technology, and Packaging II, 60350S (5 January 2006); https://doi.org/10.1117/12.638259

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