Paper
5 January 2006 High g testing of MEMS devices
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Abstract
Replicating the mechanical environments to which MEMS devices (Micro- Electro-Mechanical Systems) are exposed requires extreme test strategies. Acceleration levels in the 10's of thousands of g's is a normal occurrence in today's MEMS applications. Traditional test methods in use for over a half century are no longer adequate. New test methods are constantly required to meet the demanding quality and reliability levels of everything from emerging consumer applications to safety critical military and automotive systems.
© (2006) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Robert P. O'Reilly "High g testing of MEMS devices", Proc. SPIE 6111, Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS V, 61110I (5 January 2006); https://doi.org/10.1117/12.650722
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Cited by 1 scholarly publication.
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KEYWORDS
Microelectromechanical systems

Sensors

Amplifiers

Reliability

Gyroscopes

Missiles

Data modeling

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