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28 February 2006 Three-dimensional chip-scale optical interconnects and switches with self-organized wiring based on device-embedded waveguide films and molecular nanotechnologies
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Abstract
We review our strategy toward chip-scale optical interconnect/switching with nano-scale packaging. A threedimensional optoelectronic (3-D OE) platform "System in S-FOLM" consisting of stacked OE films with embedded thin-film devices provides multilayer OE boards, 3-D stacked OE LSIs, 3-D optical switching systems, and so on. OE Amplifier/Driver-Less Substrate (OE-ADLES), where E-O and O-E conversions are respectively carried out by light modulators directly-driven by LSI output and by photodetectors directly-generating LSI input, reduces power dissipation and increases data rate in the platform. To realize the 3-D OE platform, waveguide films with surface-normal mirrors, resource-saving heterogeneous integration, 3-D optical wiring, and nano optical ICs and their mass production processes are required. These will be achieved our five original core technologies: the built-in mask method, PL-Pack with SORT, SOLNET, the molecular-controlled growth, and MND. The FDTD simulation reveals that in nano optical ICs of photonic crystals ~0.6-ps delay arises to complete lightwave interferences and confine lightwaves into waveguide regions. In addition, the molecular-controlled growth may enable future molecular transistor circuits.
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Tetsuzo Yoshimura, Yoshiyuki Suzuki, Noriyuki Shimoda, Toshiaki Kofudo, Keiichi Okada, Yukihiko Arai, and Kunihiko Asama "Three-dimensional chip-scale optical interconnects and switches with self-organized wiring based on device-embedded waveguide films and molecular nanotechnologies", Proc. SPIE 6126, Photonics Packaging and Integration VI, 612609 (28 February 2006); https://doi.org/10.1117/12.637582
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