Paper
24 March 2006 Thermal stress kinetics in the microresist-silicon system
S. Tamulevicius, V. Grigaliunas, D. Jucius, V. Ostasevicius, A. Palevicius, G. Janusas
Author Affiliations +
Abstract
In this work we report stress kinetics of thermoplastic polymer mr-I 8020 on crystalline silicon during thermal exposure to the temperature ranges typically applied in the imprint experiment. Stress kinetics in the polymer-silicon structure was measured experimentally in-situ using a Michelson interferometer and controlling temperature of the structure by thermocouple. The changes of radius of curvature due to the thermal heating were measured by laser (λ=633nm) interferometer and corresponding stress was calculated using a Stoney formula. It is shown that within the temperatures below the polymer glassing temperatures elastic response of the polymer dominates for different time of heating and cooling.
© (2006) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
S. Tamulevicius, V. Grigaliunas, D. Jucius, V. Ostasevicius, A. Palevicius, and G. Janusas "Thermal stress kinetics in the microresist-silicon system", Proc. SPIE 6151, Emerging Lithographic Technologies X, 61512I (24 March 2006); https://doi.org/10.1117/12.659952
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KEYWORDS
Polymers

Silicon

Nanoimprint lithography

Crystals

Interferometers

Semiconductor lasers

Electronics

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