Paper
24 March 2006 In-line CD metrology with combined use of scatterometry and CD-SEM
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Abstract
Measurement characteristics in scatterometry and CD-SEM for lot acceptance sampling of inline critical dimension (CD) metrology were investigated by using a statistical approach with Monte Carlo simulation. By operation characteristics curve analysis, producer's risk and consumer's risk arising from sampling were clarified. Single use of scatterometry involves a higher risk, such risk being particularly acute in the case of large intra-chip CD variation because it is unable to sufficiently monitor intra-chip CD variation including local CD error. Substituting scatterometry for conventional SEM metrology is accompanied with risks, resulting in the increase of unnecessary cost. The combined use of scatterometry and SEM metrology in which the sampling plan for SEM is controlled by scatterometry is a promising metrology from the viewpoint of the suppression of risks and cost. This is due to the effect that CD errors existing in the distribution tails are efficiently caught.
© (2006) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Masafumi Asano, Takahiro Ikeda, Toru Koike, and Hideaki Abe "In-line CD metrology with combined use of scatterometry and CD-SEM", Proc. SPIE 6152, Metrology, Inspection, and Process Control for Microlithography XX, 61521V (24 March 2006); https://doi.org/10.1117/12.656326
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Cited by 2 scholarly publications.
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KEYWORDS
Scatterometry

Critical dimension metrology

Metrology

Scanning electron microscopy

Monte Carlo methods

Inspection

Time metrology

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