Impact of process variation on 65nm across-chip linewidth variation

Le Hong; Travis Brist; Pat LaCour; John Sturtevant; Martin Niehoff; Philipp Niedermaier

doi:10.1117/12.660541

14 March 2006 Impact of process variation on 65nm across-chip linewidth variation

Le Hong, Travis Brist, Pat LaCour, John Sturtevant, Martin Niehoff, Philipp Niedermaier

Proceedings Volume 6156, Design and Process Integration for Microelectronic Manufacturing IV; 61560Q (2006) https://doi.org/10.1117/12.660541
Event: SPIE 31st International Symposium on Advanced Lithography, 2006, San Jose, California, United States

Abstract

The latest improvements in process-aware lithography modeling have resulted in improved simulation accuracy through the dose and focus process window. This coupled with the advancements in high speed, full chip grid-based simulation provide a powerful combination for accurate process window simulation. At the 65nm node, gate CD control becomes ever more critical so understanding the amount of CD variation through the full process window is crucial. This paper will use the aforementioned simulation capability to assess the impact of process variation on ACLV (Across-Chip Linewidth Variation) and critical failures at the 65nm node. The impact of focus, exposure, and misalignment errors in manufacturing is explored to quantify both CD control and catastrophic printing failure. It is shown that there is good correlation between predicted and experimental results.

Citation Download Citation

Le Hong, Travis Brist, Pat LaCour, John Sturtevant, Martin Niehoff, and Philipp Niedermaier "Impact of process variation on 65nm across-chip linewidth variation", Proc. SPIE 6156, Design and Process Integration for Microelectronic Manufacturing IV, 61560Q (14 March 2006); https://doi.org/10.1117/12.660541

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