Laser direct imaging of high-density interconnect patterns on PCB

R. Barbucha; M. Kocik; J. Mizeraczyk; G. Kozioł; J. Borecki

doi:10.1117/12.660921

9 December 2005 Laser direct imaging of high-density interconnect patterns on PCB

R. Barbucha, M. Kocik, J. Mizeraczyk, G. Kozioł, J. Borecki

Proceedings Volume 6157, Workshop on Laser Applications in Europe; 61570L (2005) https://doi.org/10.1117/12.660921
Event: EPIC/SPIE Workshop on laser applications in Europe, 2005, Dresden, Germany

Abstract

The increasing demands for miniaturization of electronic components and devices is observed. This caused a significant effect on the requirements faced on the printed circuit board (PCB) industry. PCB manufactures are driving for producing high density interconnect (HDI) boards at significantly reduced cost and reduced implementation time. The interconnection complexity of the PCB is still growing and today calls for 50/50 μm or 25/25 μm technology are real. Existing technologies, e.g. photolithograpy, are unable to offer such resolution. Laser Direct Imaging (LDI) technology is considered as an answer for these challenges. LDI is a process of imaging electric circuits directly on PCB without the use of a mask. The exposure of the photo-sensitive resist is carried out using a laser beam that is scanned across photoresist surface and switched on and off by means of a computer control system according to the electrical circuit pattern. Usually the laser used in the LDI generates a UV line, which is suitable to the commonly available photoresists. In this paper we present our recent results on the use a UV Nd:YAG laser (λ=355 nm) for direct imaging the circuitry pattern on the PCB covered by a photosensitive resist.

Citation Download Citation

R. Barbucha, M. Kocik, J. Mizeraczyk, G. Kozioł, and J. Borecki "Laser direct imaging of high-density interconnect patterns on PCB", Proc. SPIE 6157, Workshop on Laser Applications in Europe, 61570L (9 December 2005); https://doi.org/10.1117/12.660921

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