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9 December 2005 Investigation of UV picosecond laser ablation of polymers
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Proceedings Volume 6157, Workshop on Laser Applications in Europe; 61570T (2005)
Event: EPIC/SPIE Workshop on laser applications in Europe, 2005, Dresden, Germany
UV picosecond laser pulses have been shown to be able to etch clean holes in polymers. This process has numerous applications in processing polymers. We present the results obtained by the investigation of the laser ablation process with picosecond pulses in 19 different organic materials. Micro-drilling and cutting of polymers were performed by the 355 and 266 nm radiation. The ablation rate versus laser fluence was investigated. Polymers showed the logarithmic ablation rate versus the laser fluence proving a well known Beer's model of laser ablation. Two ablation thresholds were observed in most of the polymers. One of them was below 1 J/cm2 with a low material removal rate. Another threshold was spread in the range of 3 - 30 J/cm2 and a rapid increase in the ablation rate was found above it. The processing of polymers was tested in fabrication of cavities relevant to different micro-devices. Combined cavities for the ink-jet printer head and micro-fluidic set were formed by laser etching. UV laser radiation with the picosecond pulse duration can be useful in manufacturing micro-systems for diverse technical applications.
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Mindaugas Gedvilas and Gediminas Račiukaitis "Investigation of UV picosecond laser ablation of polymers", Proc. SPIE 6157, Workshop on Laser Applications in Europe, 61570T (9 December 2005);

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