Passive damping of thin film Nitinol

Catherine A. Kerrigan; K. P. Mohachandra; Gregory P. Carman

doi:10.1117/12.658824

17 March 2006 Passive damping of thin film Nitinol

Catherine A. Kerrigan, K. P. Mohachandra, Gregory P. Carman

Proceedings Volume 6169, Smart Structures and Materials 2006: Damping and Isolation; 61690M (2006) https://doi.org/10.1117/12.658824
Event: SPIE Smart Structures and Materials + Nondestructive Evaluation and Health Monitoring, 2006, San Diego, California, United States

Abstract

Thin film Nitinol is evaluated for a new damping solution to microscale damping. In this study, thin film Nitinol was mechanically tested under steady and cyclic tensile loads in a DMA Q800 load frame to determine stiffness and hysteric losses (tan δ = 0.17). A method of determining the damping properties of a multilayered laminate was derived and evaluated using measured and predicted values of Nitinol film damping. Hysteretic loss of tan δ = 0.76 was predicted for a tensile/compressive loading of a film indicative of loading in a MEMS structure. Damping in a silicon/Nitinol laminate using the tensile/compressive loading film damping prediction was calculated to be tan δ = 0.127.

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Catherine A. Kerrigan, K. P. Mohachandra, and Gregory P. Carman "Passive damping of thin film Nitinol", Proc. SPIE 6169, Smart Structures and Materials 2006: Damping and Isolation, 61690M (17 March 2006); https://doi.org/10.1117/12.658824

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KEYWORDS

Thin films

Silicon

Microelectromechanical systems

Semiconducting wafers

Shape memory alloys

Absorption

Multilayers

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