You have requested a machine translation of selected content from our databases. This functionality is provided solely for your convenience and is in no way intended to replace human translation. Neither SPIE nor the owners and publishers of the content make, and they explicitly disclaim, any express or implied representations or warranties of any kind, including, without limitation, representations and warranties as to the functionality of the translation feature or the accuracy or completeness of the translations.
Translations are not retained in our system. Your use of this feature and the translations is subject to all use restrictions contained in the Terms and Conditions of Use of the SPIE website.
Thin film Nitinol is evaluated for a new damping solution to microscale damping. In this study, thin film Nitinol was mechanically tested under steady and cyclic tensile loads in a DMA Q800 load frame to determine stiffness and hysteric losses (tan δ = 0.17). A method of determining the damping properties of a multilayered laminate was derived and evaluated using measured and predicted values of Nitinol film damping. Hysteretic loss of tan δ = 0.76 was predicted for a tensile/compressive loading of a film indicative of loading in a MEMS structure. Damping in a silicon/Nitinol laminate using the tensile/compressive loading film damping prediction was calculated to be tan δ = 0.127.
The alert did not successfully save. Please try again later.
Catherine A. Kerrigan, K. P. Mohachandra, Gregory P. Carman, "Passive damping of thin film Nitinol," Proc. SPIE 6169, Smart Structures and Materials 2006: Damping and Isolation, 61690M (17 March 2006); https://doi.org/10.1117/12.658824