Transfer function characterization of thermally-actuated displacement-amplified micro-electromechanical systems (MEMS)

Timothy Reissman; Ephrahim Garcia; Nicolae Lobontiu; Yoonsu Nam

doi:10.1117/12.658590

31 March 2006 Transfer function characterization of thermally-actuated displacement-amplified micro-electromechanical systems (MEMS)

Timothy Reissman, Ephrahim Garcia, Nicolae Lobontiu, Yoonsu Nam

Author Affiliations +

Proceedings Volume 6172, Smart Structures and Materials 2006: Smart Electronics, MEMS, BioMEMS, and Nanotechnology; 61721B (2006) https://doi.org/10.1117/12.658590
Event: SPIE Smart Structures and Materials + Nondestructive Evaluation and Health Monitoring, 2006, San Diego, California, United States

Abstract

In this paper the dynamics of MEMS devices is explored, which characterizes the behavior of a thermally-actuated MEMS in order to perform a system identification enabling controlled operation of the micro-device. By considering the input to the system is the current/voltage and the output is the amplified mechanical displacement, a transfer function, TF, is derived which includes energy losses due to the imperfect energy conversion from electric to thermal, and which correspond to various phenomena, such as convection, radiation and conduction - accounting for a Joule-effect temperature less than the ideal one. This TF also includes the relationship between temperature and the mechanical deformation of both "active and passive" flexure hinges, which are thermally-actuated and which contribute to the kinematics of the output motion of the micro-device. This TF model is validated by means of experimental data from an actual displacement-amplification MEMS which was fabricated by means of the PolyMUMPs surface machining technology.

Citation Download Citation

Timothy Reissman, Ephrahim Garcia, Nicolae Lobontiu, and Yoonsu Nam "Transfer function characterization of thermally-actuated displacement-amplified micro-electromechanical systems (MEMS)", Proc. SPIE 6172, Smart Structures and Materials 2006: Smart Electronics, MEMS, BioMEMS, and Nanotechnology, 61721B (31 March 2006); https://doi.org/10.1117/12.658590

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KEYWORDS

Actuators

Microelectromechanical systems

Convection

Thermal modeling

Mathematical modeling

Resistance

Thermal analysis

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