10+ Gb/s board-level optical interconnects: fabrication, assembly, and testing

Alexei L. Glebov; Michael G. Lee; Kishio Yokouchi

doi:10.1117/12.673842

21 April 2006 10+ Gb/s board-level optical interconnects: fabrication, assembly, and testing

Alexei L. Glebov, Michael G. Lee, Kishio Yokouchi

Proceedings Volume 6185, Micro-Optics, VCSELs, and Photonic Interconnects II: Fabrication, Packaging, and Integration; 618501 (2006) https://doi.org/10.1117/12.673842
Event: SPIE Photonics Europe, 2006, Strasbourg, France

Abstract

Fabrication and assembly technologies for high-speed board-to-board optical interconnect (B²OI) systems are presented. In the system architecture, the transmitters and receivers are placed on the linecards and the optical signals are routed to the optically passive backplane through the optical jumpers with MTP connectors. The backplane contains an optical layer with embedded polymer waveguides and 45° reflector micromirrors. The waveguides are fabricated by direct lithographic patterning and have propagation losses as low as 0.05 dB/cm at 850 nm. Hot-embossing is also evaluated for the waveguide fabrication demonstrating the waveguide propagation losses in the range of 0.06-0.1 dB/cm but rather poor channel-to-channel uniformity. The wedge dicing technology is developed for fabrication of the 45° reflector micromirrors with 0.5 dB losses. The pluggable optical connectors with microlens adaptors are used to couple the light from the optical jumpers into the backplane waveguides. The fabricated prototype optical interconnect modules with integrated channel waveguides, mirrors, and assembled connectors demonstrate insertion losses of 5-6 dB. The modules successfully pass high-speed transmission tests at data rates up to 11 Gb/s.

Citation Download Citation

Alexei L. Glebov, Michael G. Lee, and Kishio Yokouchi "10+ Gb/s board-level optical interconnects: fabrication, assembly, and testing", Proc. SPIE 6185, Micro-Optics, VCSELs, and Photonic Interconnects II: Fabrication, Packaging, and Integration, 618501 (21 April 2006); https://doi.org/10.1117/12.673842

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